Thin film resistor

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United States of America Patent

PATENT NO 8426745
APP PUB NO 20110128692A1
SERIAL NO

12868659

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Abstract

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A method and structure for a semiconductor device which provides for an etch of a metal layer such as an interconnect layer which does not affect a thinner layer such as a thin film resistor (TFR) layer, such as a circuit resistor. In one embodiment, a TFR resistor layer is protected by a patterned protective layer during an etch of the metal layer, and provides an underlayer for the metal layer. In another embodiment, the TFR layer is formed after providing the patterned metal layer. The metal layer can provide, for example, end caps for the circuit resistor.

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Patent Owner(s)

  • INTERSIL AMERICAS LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Church, Michael David Sebastian, US 16 194
Gaul, Stephen Jospeh Melbourne Village, US 1 18

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