Sensor module
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United States of America Patent
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Apr 23, 2013
Grant Date -
Oct 28, 2010
app pub date -
Mar 23, 2010
filing date -
Mar 30, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A sensor module includes a housing and a chip system disposed therein, the chip system being disposed on a substrate and being embedded in a sealing layer deposited on the substrate. The chip system is disposed in a window region of a frame structure disposed on the substrate, the frame structure featuring substantially the same thermal expansion properties as the substrate.
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