Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module
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United States of America Patent
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Apr 23, 2013
Grant Date -
Feb 18, 2010
app pub date -
Aug 11, 2009
filing date -
Aug 12, 2008
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor apparatus includes, a semiconductor substrate having first and second main surfaces and a through hole connecting the first and second main surfaces; a first insulation layer arranged on the first main surface, and having an opening corresponding to the through hole; a first conductive layer arranged on the first insulation layer, and covering the through hole; a second insulation layer arranged on an inner wall of the through hole and the second surface; a second conductive layer arranged in the through hole and on the second insulation layer, the second conductive layer contacting the first conductive layer; and a filling member arranged on the second conductive layer in the through hole, and having a gap between the second conductive layer on the first main surface side.
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