Test systems and methods for semiconductor devices
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United States of America Patent
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Apr 23, 2013
Grant Date -
Dec 9, 2010
app pub date -
Aug 18, 2010
filing date -
Sep 26, 2007
priority date (Note) -
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Abstract
Test structures, systems, and methods for semiconductor devices are disclosed. In one embodiment, a test structure for a semiconductor device includes a winding disposed in at least one conductive material layer of the semiconductor device. At least a portion of the winding extends proximate a perimeter of the semiconductor device. The winding includes a first end and a second end. A first test pad is coupled to the first end of the winding, and a second test pad is coupled to the second end of the winding.
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