MEMS microphone packaging and MEMS microphone module
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United States of America Patent
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Apr 23, 2013
Grant Date -
Jun 2, 2011
app pub date -
Nov 30, 2009
filing date -
Nov 30, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A method for producing a microphone module includes arranging a MEMS microphone structure on a first surface of a first substrate, the first substrate further including a second surface, which is opposite to the first surface. Furthermore, a cap is arranging on the first surface of the first substrate such that the cap and the first surface enclose the MEMS microphone structure. A readout device for the MEMS microphone structure is arranged on a first surface of a second substrate which further includes a second surface, which is opposite to the first surface. The second surface of the first substrate is attached to the second surface of the second substrate.
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