Three dimensional integrated circuits

United States of America Patent

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Apr 23, 2013
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Feb 27, 2006
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Jul 8, 2002

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Abstract

A three-dimensional semiconductor device, comprising: a circuit block located in a first module layer; and a configuration circuit to control the circuit block further comprising a configurable element in a second module layer positioned above the first module layer.

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LIBERTY PATENTS LLC	2325 OAK ALLEY TYLER TX 75703

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G06F:ELECTRIC DIGITAL DATA PROCESSING

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Inventor Name	Address	# of filed Patents	Total Citations
Madurawe, Raminda Udaya	Sunnyvale, US	83	5960

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Three dimensional integrated circuits

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United States of America Patent

11363304

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US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 23, 2013	US,8429585,B2 US8429585B2	GRANTED PATENT AS SECOND PUBLICATION
July 06, 2006	US,20060150137,A1 US20060150137A1	FIRST PUBLISHED PATENT APPLICATION

PATENT NO	8429585
SERIAL NO	11363304
DOCKET NO

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11363304

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