Via design apparatus and via design method based on impedance calculations
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United States of America Patent
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Apr 23, 2013
Grant Date -
Sep 30, 2010
app pub date -
May 17, 2010
filing date -
Nov 21, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A via design apparatus includes a determination section that determines a value of a shape parameter indicating a shape of a via in a multilayer board. The via has a hole passing through the plurality of layers and a conductive section on a side wall of the hole. The apparatus also includes a calculation section that calculates a value of impedance of the via according to the value of the shape parameter.
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