Manufacturing method of substrate, manufacturing method of wiring board, wiring board, electronic device, electron source, and image display apparatus
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United States of America Patent
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Apr 30, 2013
Grant Date -
Apr 9, 2009
app pub date -
Jun 29, 2007
filing date -
Jul 28, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for manufacturing an electronic substrate structure comprising a substrate, a glass layer, and a conductive layer. This method may include the steps of arranging the glass layer on the substrate, arranging the conductive layer that includes a precious metal particle on the glass layer while directly contacting the glass layer, and heating the glass layer together with the conductive layer at a temperature that is lower than a softening point of the glass layer so that the particle is put into the glass layer. The particle has a diameter of not less than 1 μm and not more than 10 μm.
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