Bonding method of base materials, and manufacturing method of image display apparatus
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United States of America Patent
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Apr 30, 2013
Grant Date -
Mar 17, 2011
app pub date -
Sep 10, 2010
filing date -
Sep 14, 2009
priority date (Note) -
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Abstract
It arranges a bonding material between a pair of base materials having different heat capacities and in which a difference between thermal expansion coefficients thereof is within 10×10−7/° C.; and bonds the pair of the base materials by the bonding material, by irradiating electromagnetic wave to the bonding material to melt and then harden it, wherein a thermal expansion coefficient at part of the bonding material facing one of the pair of the base materials of which the heat capacity is smaller is smaller than a thermal expansion coefficient at part of the bonding material facing the other of the pair of the base materials of which the heat capacity is larger by a difference within 10×10−7/° C., thereby bonding the base materials of which a difference of thermal expansion coefficients is relatively small, as preventing breakage and crack from occurring and further suppressing a degree of warp.
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