Heat dissipation device having heat sink enclosing conductive member therein
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United States of America Patent
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Apr 30, 2013
Grant Date -
Apr 14, 2011
app pub date -
Dec 21, 2009
filing date -
Oct 12, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A heat dissipation device includes a base, a first heat sink mounted over the base and connected to the base via two first heat pipes, and a second heat sink located at a lateral side of the first heat sink and thermally connected to the base via a second heat pipe. The first heat sink includes two fin groups. One of the fin groups is stacked on the other fin group. Each of the fin groups includes a plurality of fins spreading radially from a center of the fin group to a periphery of the fin group along horizontal directions.
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