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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
DOW GLOBAL TECHNOLOGIES LLC	2211 H H DOW WAY MIDLAND MI 48674

International Classification(s)

• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Dhoble, Avin V	Waltham, US	8	28
Fleming, David	Northborough, US	22	242
Gallagher, Michael K	Hopkinton, US	91	1302
Ho, Kim S	Richboro, US	8	90
Liu, Xiang-Qian	Collegeville, US	16	38
Peera, Asghar A	Cary, US	32	29
Robinson, Glenn N	Naperville, US	7	30
Tomlinson, Ian A	Midland, US	71	881
Winkle, Mark R	Lansdale, US	19	140

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 30, 2013	US,8430294,B2   US8430294B2	GRANTED PATENT AS SECOND PUBLICATION
April 04, 2013	US,20130082093,A1   US20130082093A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 8430294

Amine, carboxylic acid flux composition and method of soldering

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