Die mounting assembly formed of dissimilar materials
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United States of America Patent
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Apr 30, 2013
Grant Date -
Dec 15, 2011
app pub date -
Jun 10, 2010
filing date -
Jun 10, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A mounting assembly for a microelectronic device, the mounting assembly includes (a) a first member formed of a first material having a first coefficient of thermal expansion, the first member including i) a mounting surface for the microelectronic device; ii) a wall that adjoins the mounting surface and that is recessed from the mounting surface; and iii) an extension of the mounting surface that extends beyond an end of the wall; and (b) a second member formed of a plastic material having a second coefficient of thermal expansion that is larger than the first coefficient of thermal expansion, wherein a first portion of the second member is attached to the extension.
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