Liquid discharge device and manufacturing method thereof
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United States of America Patent
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Apr 30, 2013
Grant Date -
Sep 30, 2010
app pub date -
Mar 29, 2010
filing date -
Mar 30, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A bump is disposed on a surface of an actuator unit and communicated with a corresponding electrode of the actuator unit, and a part of the bump is extended through an insulating covering material to be electrically connected to a corresponding terminal of a wiring board. When a point which is positioned on an outer circumferential surface of a base end portion of the bump, and is closest to a drive part is assumed to be a closest point, and a point which is positioned on the outer circumferential surface of the base end portion of the bump, and is most distant from the drive part is assumed to be a most distant point, a close region including the closest point is processed such that the uncured insulating covering material is less likely to flow in the close region than in a distant region including the most distant point.
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