Socket using contact to hold solder ball and method of making the same
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United States of America Patent
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Apr 30, 2013
Grant Date -
Mar 15, 2012
app pub date -
Sep 14, 2011
filing date -
Sep 14, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A socket (100) comprises a base (1), a plurality of contacts (4, 3) respectively disposed therein and a plurality of solder balls (5) each connecting to the corresponding contacts (4, 3), the base comprises a central slot (1041) for receiving a module and a plurality of passageways (1031, 1022) at two sides of the central slot (4041) to receive the contacts (4, 3), respectively, the contact (4, 3) comprises a body portion (41, 31) positioned in the base (1), a contact portion (431, 331) extending from the body portion (41, 31) into the central slot (1041) and a tail (42, 32) extending from the body portion (41, 31), the solder balls (5) are positioned by the tails (421, 321) of the contacts (4, 3).
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