Grounding structures for header and receptacle assemblies
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United States of America Patent
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Apr 30, 2013
Grant Date -
Jan 17, 2013
app pub date -
Jul 13, 2011
filing date -
Jul 13, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A header assembly includes a header housing configured for mating with a receptacle assembly. The header housing has a base wall. Header signal contacts are coupled to the base wall. The header signal contacts are configured to be terminated to a circuit board. The header signal contacts are configured to be terminated to corresponding receptacle signal contacts of the receptacle assembly. Header shields are coupled to the base wall. The header shields at least partially surround, and provide electrical shielding for, corresponding header signal contacts. The header shields have walls and mating tabs that extend from corresponding walls. The mating tabs are configured to engage corresponding ground shields of the receptacle assembly.
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