Copper alloy containing cobalt, nickel and silicon
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United States of America Patent
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Apr 30, 2013
Grant Date -
Jun 14, 2007
app pub date -
Oct 26, 2006
filing date -
Jul 5, 2002
priority date (Note) -
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Abstract
A copper alloy having an improved combination of yield strength and electrical conductivity contains, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up to 1% of silver.
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