Circuit board and method of manufacturing the same
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United States of America Patent
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-
Apr 30, 2013
Grant Date -
Jan 7, 2010
app pub date -
Jun 26, 2009
filing date -
Jul 1, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided are a circuit board and a method of manufacturing the same. The method includes: forming a pad portion and a lead line portion of a metal on an insulating substrate, wherein the lead line portion is connected to the pad portion; forming a conductive layer on the pad portion and the lead line portion, wherein the conductive layer has an upper surface comprising gold; forming an etching mask on the conductive layer so as to expose a portion corresponding to the lead line portion in the conductive layer; etching a portion of the lead line portion exposed by the etching mask and a portion of the conductive layer corresponding to the lead line portion using an etching solution containing an acid; and removing the etching mask.
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