Process for manufacturing crystal resonator
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United States of America Patent
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Apr 30, 2013
Grant Date -
Dec 16, 2010
app pub date -
Jun 3, 2010
filing date -
Jun 12, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There is provided a crystal resonator (crystal element) in which the probability of chipping occurring in separation is small when there is one supporting section with respect to a frame section of a crystal wafer, and inclined surfaces due to the anisotropy of etching are eliminated. The present invention relates to a crystal resonator manufacturing method such that an AT-cut crystal wafer is etched, a large number of rectangular crystal elements are joined with frame sections by supporting sections, and the crystal elements are mechanically cut away from the frame sections. On both sides of the +X-axis one end section of the crystal element, at least the outer side surface has a planarly tapered projection having a triangular inclined surface with an apex in the −X-axis direction, and the tip end of the projection has processing traces of the etching in the +X-axis direction.
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