Methods of forming electrically conductive structures
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United States of America Patent
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Apr 30, 2013
Grant Date -
Sep 1, 2011
app pub date -
May 7, 2011
filing date -
Mar 20, 2008
priority date (Note) -
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Abstract
Some embodiments include methods of forming conductive material within high aspect ratio openings and low aspect ratio openings. Initially, the high aspect ratio openings may be filled with a first conductive material while the low aspect ratio openings are only partially filled with the first conductive material. Additional material may then be selectively plated over the first conductive material within the low aspect ratio openings relative to the first conductive material within the high aspect ratio openings. In some embodiments, the additional material may be activation material that only partially fills the low aspect ratio opening, and another conductive material may be subsequently plated onto the activation material to fill the low aspect ratio openings.
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