Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications
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United States of America Patent
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Apr 30, 2013
Grant Date -
Nov 8, 2012
app pub date -
Jul 16, 2012
filing date -
Jun 25, 2004
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Abstract
An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.
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