Co-extruded, multilayered polyolefin-based backsheet for electronic device modules
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United States of America Patent
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Apr 30, 2013
Grant Date -
May 6, 2010
app pub date -
Nov 4, 2009
filing date -
Nov 6, 2008
priority date (Note) -
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Abstract
Multilayer structures useful as a backsheet for an electronic device, e.g., a photovoltaic cell, comprise (A) a top layer comprising a polyolefin resin, e.g., ethylene vinyl acetate, and having a top facial surface and a bottom facial surface, (B) a tie layer comprising an adhesive, e.g., an ethylene glycidyl methacrylate, having a top facial surface and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the top layer, and (C) a bottom layer comprising a polyolefin having at least one melting peak greater than 125° C., e.g., a polypropylene, and having a top facial layer and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the tie layer.
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