Forming in-situ micro-feature structures with coreless packages
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United States of America Patent
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Apr 30, 2013
Grant Date -
Oct 6, 2011
app pub date -
Apr 6, 2010
filing date -
Apr 6, 2010
priority date (Note) -
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Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a carrier material, forming dielectric material surrounding the die, forming buildup layers in the dielectric material to form a coreless bumpless buildup package structure, and patterning the carrier material to form microchannel structures on the package structure.
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