Stable electroless fine pitch interconnect plating
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United States of America Patent
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Apr 30, 2013
Grant Date -
Jul 28, 2011
app pub date -
Apr 4, 2011
filing date -
Jul 21, 2003
priority date (Note) -
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Abstract
A method and apparatus for plating facilitates the plating of a small contact feature of a wafer die while providing a relatively stable plating bath. The method utilizes a supplemental plating structure that is larger than a die contact that is to be plated. The supplemental plating structure may be located on the wafer, and is conductively connected to the die contact. Conductive connection between the die contact and the supplemental plating structure facilitates the plating of the die contact. The supplemental plating structure also can be used to probe test the die prior to singulation.
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