Epoxy resin composition

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United States of America Patent

PATENT NO 8431654
APP PUB NO 20100193228A1
SERIAL NO

12451798

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An epoxy resin composition containing an epoxy resin and a thermal cationic polymerization initiator not only can reduce the amount of fluorine ions generated during thermal cationic polymerization to improve electrolytic corrosion resistance but also is excellent in low-temperature rapid curability. The epoxy resin composition uses a sulfonium borate complex represented by the formula (1) as the thermal cationic polymerization initiator.

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Patent Owner(s)

Patent OwnerAddress
SONY CHEMICAL & INFORMATION DEVICE CORPORATIONTOKYO 141-0032

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aizaki, Ryota Tochigi, JP 4 9
Hayashi, Naoki Tochigi, JP 299 2765
Konishi, Misao Tochigi, JP 13 54
Shinya, Yoshihisa Tochigi, JP 62 551
Yamamoto, Jun Tochigi, JP 133 816

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