Bond strength and interconnection in a via
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United States of America Patent
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Apr 30, 2013
Grant Date -
Apr 8, 2010
app pub date -
Oct 8, 2008
filing date -
Oct 8, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A via is provided on a printed circuit board with at least one additional depression encompassing the via, such that the via passes through a portion of the depression. Solder can pool in the depression, allowing for a stronger mechanical bond and eliminating many issues with respect to a lack of coplanarity between a lead and the printed circuit board. The depression can be provided with plugged and unplugged vias, and improves the mountings associated with both.
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