MEMS package and method for the production thereof

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United States of America Patent

PATENT NO 8432007
APP PUB NO 20110186943A1
SERIAL NO

13075936

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Abstract

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A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.

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Patent Owner(s)

  • TDK CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Krueger, Hans Munich, DE 74 1118
Leidl, Anton Hohenbrunn, DE 33 836
Pahl, Wolfgang Munich, DE 66 1815
Seitz, Stefan Windach, DE 25 551
Stelzl, Alois Munich, DE 38 1001

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