Semiconductor device and wire bonding method
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United States of America Patent
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Apr 30, 2013
Grant Date -
Aug 19, 2010
app pub date -
Sep 12, 2008
filing date -
Sep 13, 2007
priority date (Note) -
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Abstract
A semiconductor device (2) includes: a FLR (65) that is disposed on a semiconductor substrate so as to divide the semiconductor substrate into an inner region and an outer region; a first bonding pad (24a to 24d) that is disposed in the inner region and is connected to an external circuit by a wire (14a to 14d) whose one end is connected to the external circuit; and a second bonding pad (26a to 26d) that is disposed in the outer region and on which the other end of the wire is bonded.
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