Integrated circuit including bond wire directly bonded to pad

United States of America Patent

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Apr 30, 2013
Grant Date
Oct 27, 2011
app pub date
Apr 27, 2010
filing date
Apr 27, 2010

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Abstract

An integrated circuit includes a chip including a copper bond pad metallization, and a copper bond wire including a copper ball. The copper ball is bonded directly to the copper bond pad.

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Patent Owner(s)

Patent Owner	Address
INFINEON TECHNOLOGIES AG	GERMAN NOE BE BERG NEUBIBERG BAVARIA

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Koenig, Lothar	Laaber, DE	7	34
Schneegans, Manfred	Vaterstetten, DE	57	290

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Integrated circuit including bond wire directly bonded to pad

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United States of America Patent

12768134

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PATENT NO	8432024
APP PUB NO	20110260307A1
SERIAL NO	12768134
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 30, 2013	US,8432024,B2 US8432024B2	GRANTED PATENT AS SECOND PUBLICATION
October 27, 2011	US,20110260307,A1 US20110260307A1	FIRST PUBLISHED PATENT APPLICATION

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12768134

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