Stackable multi-chip package system
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United States of America Patent
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Apr 30, 2013
Grant Date -
Feb 7, 2008
app pub date -
Aug 4, 2006
filing date -
Aug 4, 2006
priority date (Note) -
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Abstract
A stackable multi-chip package system is provided including forming a first external interconnect having a first through hole and a second external interconnect having a second through hole, forming a first package subassembly having the first external interconnect and a first integrated circuit die, forming a second package subassembly having the second external interconnect and a second integrated circuit die, mounting the second package subassembly over the first package subassembly, and molding the first package subassembly and the second package subassembly.
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