Use of a local constraint to enhance attachment of an IC device to a mounting platform
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United States of America Patent
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Apr 30, 2013
Grant Date -
Nov 29, 2012
app pub date -
May 25, 2011
filing date -
May 25, 2011
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An embodiment is directed to an IC mounting assembly that comprises an IC device having a first planar surface, wherein multiple electrically conductive first terminals are located at the first surface. The assembly further comprises an IC device mounting platform having a second planar surface in closely spaced relationship with the first surface, wherein multiple electrically conductive second terminals are located at the second surface, each second terminal corresponding to one of the first terminals. A solder element extends between each first terminal and its corresponding second terminal, and a constraining element is fixably joined to the second surface, wherein the constraining element has a CTE which is selectively less than the CTE of the mounting platform at the second surface. The constraining element is provided with a number of holes or apertures, and each hole is traversed by a solder element that extends between a first terminal and its corresponding second terminal.
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