Lead frames with improved adhesion to plastic encapsulant
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United States of America Patent
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Apr 30, 2013
Grant Date -
Jul 22, 2010
app pub date -
Jan 15, 2010
filing date -
Jan 22, 2009
priority date (Note) -
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Abstract
A lead frame and an electronic package having improved adhesion between the lead frame and an encapsulating plastic material is disclosed. The lead frame can be pre plated having an outer layer comprising a precious metal such as palladium or gold to which is adhered a self-assembled monolayer (SAM), such as a SAM derived from an organophosphorus acid. The organophosphorus acid preferably is a mixture in which the organo groups are fluoro substituted hydrocarbons and hydrocarbons containing ethylenically unsaturated groups.
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