Multiple-membrane flexible wall system for temperature-compensated technology filters and multiplexers
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United States of America Patent
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Apr 30, 2013
Grant Date -
Dec 16, 2010
app pub date -
May 12, 2010
filing date -
May 15, 2009
priority date (Note) -
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Abstract
The present invention relates to a flexible cap system optimized for thermally-compensated technology microwave resonators. More specifically, this invention proposes a multiple-membrane flexible wall system for thermally-compensated filters and OMUX. The use of a multi-membrane flexible wall, in particular as sealing cap for a resonant cavity of an OMUX channel, makes it possible: to reduce the thermal resistance of the flexible wall, while maintaining an equivalent level of mechanical stresses exerted on said wall for a given displacement; or to reduce the mechanical stresses exerted on the flexible wall for a given displacement, while maintaining one and the same thermal resistance for said wall; or to increase the deformation of the flexible wall by maintaining an equivalent level of mechanical stresses and by maintaining an equivalent thermal resistance.
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