Electronic module, methods of manufacturing and driving the same, and electronic instrument
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United States of America Patent
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Apr 30, 2013
Grant Date -
Jun 30, 2011
app pub date -
Mar 8, 2011
filing date -
Aug 30, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic module includes an EL section; a first substrate on which the EL section is formed; a second substrate attached to the first substrate; an integrated circuit chip mounted on the second substrate; a plurality of first power supply interconnects formed on the first substrate, extending through a pair of regions located on both sides of the EL section; and a plurality of second power supply interconnects formed on the second substrate, extending through a pair of regions located on both sides of the integrated circuit chip.
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