Electronic system and heat dissipation device thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 30, 2013
Grant Date -
Jul 5, 2012
app pub date -
Mar 24, 2011
filing date -
Dec 31, 2010
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The printed circuit board is secured on a casing of an electronic system. The heat dissipation device includes a heat sink disposed on the electronic component; and a plurality of fasteners extending through the heat sink, respectively, to assemble the heat sink to the printed circuit board. Each of the fasteners includes a supporting member fixed in the printed circuit board, an engaging member fixed in the board, and a screwing post engaging with the heat sink. A bottom portion of the screwing post extends through the printed circuit board via the supporting member, and is screwed into the engaging member.
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