Motherboard assembly having serial advanced technology attachment dual in-line memory module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8432708
APP PUB NO 20130050970A1
SERIAL NO

13228459

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Abstract

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A motherboard assembly includes a motherboard having an expansion slot and a storage device interface, and a serial advanced technology attachment dual in-line memory module (SATA DIMM) with a circuit board. A control chip and a storage chip are arranged on the circuit board. Two voids are defined in a top side of the circuit board. A first extending board is formed on the top side of the circuit board between the voids. An edge connector is arranged on the first extending board and connected to a power supply. The edge connector includes power pins connected to the control chip and the storage chip. A second extending board is extended from an end edge of the circuit board and includes a connector connected to the storage device interface of the motherboard. A bottom side of the second extending board is in alignment with a bottom side of the circuit board.

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Patent Owner(s)

Patent OwnerAddress
HON HAI PRECISION INDUSTRY CO LTDNEW TAIPEI CITY
HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO LTD518109 NO TWO NO TENTH EAST RING ROAD PINUS TABULAEFORMIS INDUSTRIAL ZONE LONGHUA TOWN BAOAN DISTRICT GUANGDONG SHENZHEN 2 SHENZHEN CITY GUANGDONG PROVINCE 518100

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Guo-Yi Shenzhen, CN 93 257
Cong, Wei-Dong Shenzhen, CN 42 159

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