Communication devices with integrated thermal sensing circuit and methods for use therewith
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United States of America Patent
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Apr 30, 2013
Grant Date -
Jul 26, 2012
app pub date -
Apr 2, 2012
filing date -
May 17, 2007
priority date (Note) -
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Abstract
A communication device includes an integrated circuit having an on-chip thermal sensing circuit that generates a temperature signal based on a temperature of the integrated circuit. A processing module processes the temperature signal to generate temperature information that can be transmitted to a remote device or processes the temperature signal to generate control for adjusting transmit and/or receive characteristics of an RF transceiver.
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