Integrated circuit design and fabrication method by way of detecting and scoring hotspots

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8434030
SERIAL NO

13343774

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

An integrated circuit design and fabrication method includes the following steps. Firstly, an integrated circuit design layout is provided. Then, a first hotspot group and a second hotpot group are searched from the integrated circuit design layout. Then, a hotspot score is acquired according to the first hotspot group, the second hotpot group and a product functionality. If the hotspot score is higher than a criterion, the integrated circuit design layout is corrected according to the first hotspot group and the second hotpot group.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
UNITED MICROELECTRONICS CORPORATIONNO 3 LI-HSIN RD II SCIENCE-BASED INDUSTRIAL PARK HSINCHU

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hou, Hsin-Ming Tainan, TW 17 51
Kung, Ji-Fu Taichung, TW 23 50

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation