Method to manufacture a circuit apparatus having a rounded differential pair trace
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United States of America Patent
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-
May 7, 2013
Grant Date -
Mar 1, 2012
app pub date -
Aug 27, 2010
filing date -
Aug 27, 2010
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A first artwork layer having a first adaptable-mask section allows a graded amount of light to pass into an underlying first photoresist layer. Subsequent to developing the first photoresist layer, the graded amount of light creates a rounded geometric void used as a mold or sidewall for the creation of at least a lower portion of a rounded trace. A dielectric layer is laminated upon the lower portion and a second artwork layer having an second adaptable-mask section allows a graded amount of light to pass into a second photoresist layer. Subsequent to developing the second photoresist layer, the graded amount of light creates a rounded geometric void used as a mold or sidewall for the creation of at least an upper portion of a rounded trace. The photoresist and dielectric layers are removed resulting in a circuit apparatus having a rounded differential pair trace.
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