Magnetic attachment structure
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United States of America Patent
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May 7, 2013
Grant Date -
Nov 17, 2011
app pub date -
May 12, 2010
filing date -
May 12, 2010
priority date (Note) -
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Abstract
The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and attach microelectronic components of the microelectronic package.
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