Repair apparatus and repair method
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United States of America Patent
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May 7, 2013
Grant Date -
Dec 31, 2009
app pub date -
Jun 16, 2009
filing date -
Jun 26, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board.
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