Chemical-mechanical planarization pad including patterned structural domains
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United States of America Patent
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May 7, 2013
Grant Date -
Sep 2, 2010
app pub date -
Jan 27, 2010
filing date -
Jan 27, 2009
priority date (Note) -
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Abstract
An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.
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