Subcutaneous implantation instrument with a scissored dissecting tool assembly and method of construction
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United States of America Patent
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May 7, 2013
Grant Date -
Aug 26, 2010
app pub date -
May 5, 2010
filing date -
Aug 24, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A subcutaneous implantation instrument with a scissored dissecting tool assembly is provided. An incising shaft longitudinally defines a substantially non-circular bore continuously formed to communicatively receive an implantable object and further includes a beveled cutting blade formed on a distal end. A dissecting tool assembly is included. A longitudinally split needle tip forms a pair of blades with cutting edges progressively defined outwardly from the needle tip. A pair of handles are each distally attached to one of the blades and pivotably coupled and disposed for transverse operation, wherein the dissecting tool assembly is removably affixable to the distal end of the incising shaft. A delivery mechanism longitudinally defines a substantially non-circular bore continuously formed to deploy the implantable object into the incising shaft.
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