Thin film forming apparatus and method
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United States of America Patent
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May 7, 2013
Grant Date -
Dec 15, 2011
app pub date -
Jun 10, 2011
filing date -
Jun 11, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
According to one embodiment, the thin film forming apparatus includes a boat capable of holding two wafers, in each of which a cutout portion is provided in an outer peripheral edge portion, in a groove portion for holding a wafer in a state where back surfaces face each other. Moreover, the thin film forming apparatus includes a reactor that accommodates the boat and form a coating on each of surfaces of the two wafers by a vapor deposition reaction. The positions in the groove portion, at which the two wafers are held, respectively, are displaced in a direction parallel to the surfaces of the wafers.
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