Device and method for wet treating disc-like substrates
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United States of America Patent
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May 7, 2013
Grant Date -
Jul 5, 2012
app pub date -
Mar 8, 2012
filing date -
Jun 24, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for wet treatment of wafers includes a first plate and a second plate substantially parallel to the first plate, and a wafer is held between the first and the second plate substantially parallel. A first dispenser introduces fluid into a first gap between the first plate and the wafer when being treated, and a second dispenser introduces fluid into a second gap between the second plate and the wafer when being treated. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate.
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