Method for forming a conductive pattern and a wired board
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United States of America Patent
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May 7, 2013
Grant Date -
Oct 26, 2006
app pub date -
Apr 25, 2006
filing date -
Apr 25, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A groove and a recess are formed on one surface of a base material, the recess being communicated with the groove and having a width and a length longer than a width of the groove. After that, liquid droplets are landed on the recess to charge a liquid into the groove communicated with the recess. Further, the liquid charged into the groove is solidified. Accordingly, the liquid can be charged into the groove having the narrow width, by merely landing the liquid droplets on the recess having a large areal size. Therefore, a fine pattern can be easily formed on the base material.
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