Flexible substrates having a thin-film barrier
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United States of America Patent
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May 7, 2013
Grant Date -
Feb 23, 2012
app pub date -
Nov 2, 2011
filing date -
Nov 30, 2006
priority date (Note) -
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Abstract
Methods and apparatus provide for: applying an inorganic barrier layer to at least a portion of a flexible substrate, the barrier layer being formed from a low liquidus temperature (LLT) material; and sintering the inorganic barrier layer while maintaining the flexible substrate below a critical temperature.
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