Thermal degradation and crack resistant functionally graded cemented tungsten carbide and polycrystalline diamond
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United States of America Patent
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May 7, 2013
Grant Date -
Sep 10, 2009
app pub date -
Mar 6, 2009
filing date -
Mar 7, 2008
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Abstract
A WC—Co material or polycrystalline diamond-Co material that has a gradient in the grain size of the particles. Specifically, the material may have a top layer that has coarse grains that is designed to dissipate the heat caused by friction (and thus prevent thermal cracking). The material will then have a bulk substrate that is made up of finer grains and provide adequate hardness for the material. The top layer is positioned on top of the bulk substrate.
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