Method of manufacturing a substrate for liquid ejection head
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United States of America Patent
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May 7, 2013
Grant Date -
Mar 8, 2012
app pub date -
Aug 23, 2011
filing date -
Sep 6, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a method of manufacturing a substrate for liquid ejection head, including: forming a groove portion by etching on one surface side of a silicon substrate, the groove portion being formed so as to surround a portion at which a liquid supply port is to be formed on an inner side of the groove portion; forming a protective layer on the one surface side of the silicon substrate, the protective layer being formed inside the groove portion and on an outer side of the groove portion; and forming the liquid supply port by subjecting the silicon substrate to crystal anisotropic etching treatment with use of the protective layer as a mask.
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