Optimization of desiccant usage in a MEMS package
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United States of America Patent
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May 7, 2013
Grant Date -
Jan 20, 2011
app pub date -
Sep 28, 2007
filing date -
Sep 28, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.
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