Method for manufacturing silicon carbide substrate

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United States of America Patent

PATENT NO 8435866
APP PUB NO 20120009761A1
SERIAL NO

13256991

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Abstract

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At least one single crystal substrate, each having a backside surface and made of silicon carbide, and a supporting portion having a main surface and made of silicon carbide, are prepared. In this preparing step, at least one of the backside surface and main surface is formed by machining. By this forming step, a surface layer having distortion in the crystal structure is formed on at least one of the backside surface and main surface. The surface layer is removed at least partially. Following this removing step, the backside surface and main surface are connected to each other.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTDOSAKA-SHI OSAKA 541-0041

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujiwara, Shinsuke Itami, JP 102 694
Harada, Shin Osaka, JP 131 787
Inoue, Hiroki Itami, JP 265 2531
Namikawa, Yasuo Itami, JP 50 389
Nishiguchi, Taro Itami, JP 89 367
Okita, Kyoko Itami, JP 63 152
Sasaki, Makoto Itami, JP 458 4514

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